Packaged X Band Planar
Teledyne uses our in-house specified PIN diode die combined with our chip and wire bonding expertise across our full range of microstrip and stripline limiters.
Designed to meet the most challenging system requirements, PIN diode die selected for power handling performance are integrated within a TLM designed transmission line and circuit to minimize insertion loss and maximize protection of the receiver.
Selection of appropriate substrate material and suitable die mounting techniques are critical steps in the design of microstrip and stripline limiters. In cases where protection against peak power levels over 1kW and multiple octave frequency bandwidth is required, then passive Schottky diode bias networks may be incorporated in the design to extract maximum power handling from the PIN diode stage.
When combined with Teledyne Lincoln Microwave waveguide limiter stages, microstrip limiters offer higher levels of protection and isolation with additional user control options also becoming available.
Additional system functions can be incorporated within the limiter offering versatility and a net SWaP-C (Size, Weight and Power - Cost) benefit over discrete components. For example, an LNA might be integrated to reduce overall size and weight.