Microstrip Receiver Protector

L Band Receiver Protector on alumina tile

As radar developments have increasingly moved to passive and active electronically scanned arrays, (PESA / AESA) there has been more focus on the size/ weight/ power/ cost. Teledyne Lincoln Microwve offers a range of microstrip limiters designed to integrate simply into a wide range of land/ sea/ airborne applications. Operating between 1 - 20GHz, these products are available as compact drop-in tiles, connectorized or in surface mount format (SMT).

Microstrip Limiters At a Glance

  • Multiple stages cascaded to increase the overall level of attenuation ensuring lowest possible leakage levels
  • Parallel PIN diode elements increase the power capabilities whilst maintaining fast switching thereby ensuring swift recovery from high isolation to low insertion loss state - improving short-range radar capabilities.
  • Passive Schottky bias networks improving power withstand and switch-on times.
  • Digital or analogue controlled attenuation
  • STC (sensitivity time control)
  • Noise source
  • Built in test equipment (BITE)
  • Blanking
  • Power detectors
  • SPDT switching
  • ITAR Free

 Common Specifications

Operating Band
Bandwidth
(GHz)
Peak Operating Power
(kW)
Pulse Width
(µs)
Duty Cycle
(%)
V.S.W.R.
(ratio)
Insertion Loss
(dB)
Flat Leakage
(mW)
Spike Leakage
(mW)
Recovery (-3dB)
(µs)
L-Band 0.2 1 32 1 1.4 : 1 0.7 50 100 3
S-Band 0.6 0.002 CW 100 1.4 : 1 0.9 30 30 0.1
L / S / C-Band 6 0.025 1000 20 1.4 : 1 0.6 50 100 1
X-Band 1 0.2 100 10 1.4 : 1 1.5 100 200 0.2
Ku-Band 0.5 0.6 1 0.1 1.4 : 1 1 50 200 3


If you haven’t found exactly what you are looking for click here to contact Teledyne Lincoln Microwave about a solution which meets your exact requirement.

 Additional Information








Packaged X Band Planar
Re​​​ceiver Protector

​Teledyne uses our in-house specified PIN diode die combined with our chip and wire bonding expertise across our full range of microstrip and stripline limiters.

Designed to meet the most challenging system requirements, PIN diode die selected for power handling performance are integrated within a TLM designed transmission line and circuit to minimize insertion loss and maximize​ protection of the receiver.

Selection of appropriate substrate material and suitable die mounting techniques are critical steps in the design of microstrip and stripline limiters. In cases where protection against peak power levels over 1kW and multiple octave frequency bandwidth is required, then passive Schottky diode bias networks may be incorporated in the design to extract maximum power handling from the PIN diode stage.

When combined with Teledyne Lincoln Microwave waveguide limiter stages, microstrip limiters offer higher levels of protection and isolation with additional user control options also becoming available.

Additional system functions can be incorporated within the limiter offering versatility and a net SWaP-C (Size, Weight and Power - Cost) benefit over discrete components. For example, an LNA might be integrated to reduce overall size and weight.

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